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THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires
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Journal Title: | THERMEC 2006 |
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Authors and Corporations: | , |
In: | THERMEC 2006, 2007, p. 2798-2803 |
Type of Resource: | E-Chapter |
Language: | Undetermined |
published: |
Trans Tech Publications Ltd.
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