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THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires
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| Zeitschriftentitel: | THERMEC 2006 |
|---|---|
| Personen und Körperschaften: | , |
| In: | THERMEC 2006, 2007, S. 2798-2803 |
| Format: | E-Book-Kapitel |
| Sprache: | Unbestimmt |
| veröffentlicht: |
Trans Tech Publications Ltd.
|
| author_facet |
Meng, Liang Liu, J.B. Meng, Liang Liu, J.B. |
|---|---|
| author |
Meng, Liang Liu, J.B. |
| spellingShingle |
Meng, Liang Liu, J.B. THERMEC 2006 THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
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meng, liang |
| spelling |
Meng, Liang Liu, J.B. 0255-5476 Trans Tech Publications Ltd. http://dx.doi.org/10.4028/0-87849-428-6.2798 THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires THERMEC 2006 |
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THERMEC 2006 |
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| title |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_unstemmed |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_fullStr |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full_unstemmed |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_short |
THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_sort |
thermec 2006: progress and current status in research on nanostructured cu-ag microcomposites for conductor wires |
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http://dx.doi.org/10.4028/0-87849-428-6.2798 |
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2007 |
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2798-2803 |
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THERMEC 2006 |
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| author | Meng, Liang, Liu, J.B. |
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| institution | DE-Ch1, DE-L229, DE-D275, DE-Bn3, DE-Brt1, DE-D161, DE-Gla1, DE-Zi4, DE-15, DE-Pl11, DE-Rs1, DE-105, DE-14 |
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| physical | 2798-2803 |
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| publisher | Trans Tech Publications Ltd. |
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| series | THERMEC 2006 |
| source_id | 49 |
| spelling | Meng, Liang Liu, J.B. 0255-5476 Trans Tech Publications Ltd. http://dx.doi.org/10.4028/0-87849-428-6.2798 THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires THERMEC 2006 |
| spellingShingle | Meng, Liang, Liu, J.B., THERMEC 2006, THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_fullStr | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full_unstemmed | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_short | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_sort | thermec 2006: progress and current status in research on nanostructured cu-ag microcomposites for conductor wires |
| title_unstemmed | THERMEC 2006: Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| url | http://dx.doi.org/10.4028/0-87849-428-6.2798 |