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Online-Ressource

Materials for Advanced Packaging

Gespeichert in:

Personen und Körperschaften: Lu, Daniel (Sonstige), Wong, C.P (Sonstige)
Titel: Materials for Advanced Packaging/ edited by Daniel Lu, C.P. Wong
Format: E-Book
Sprache: Englisch
veröffentlicht:
Boston, MA Springer US 2009
Gesamtaufnahme: SpringerLink
Schlagwörter:
Electronics
Optical materials
Nanotechnology
Materials
Materials Science
Packaging > Materials
Microelectronic packaging
Buchausg. u.d.T.: Materials for advanced packaging, New York, NY : Springer, 2009, XII, 719 S.
Quelle: Verbunddaten SWB
Zugangsinformationen: Elektronischer Volltext - Campuslizenz
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spelling Materials for Advanced Packaging edited by Daniel Lu, C.P. Wong, Boston, MA Springer US 2009, Online-Ressource (digital), Text txt rdacontent, Computermedien c rdamedia, Online-Ressource cr rdacarrier, SpringerLink Bücher, Includes bibliographical references and index, Electronics, Optical materials, Nanotechnology, Materials, Materials Science, Packaging Materials, Microelectronic packaging, s (DE-588)4039207-7 (DE-627)106228811 (DE-576)209034076 Mikroelektronik gnd, (DE-627), Lu, Daniel (DE-627)1354272110 (DE-576)284272116 oth, Wong, C.P. oth, 9780387782188, Buchausg. u.d.T. Materials for advanced packaging New York, NY : Springer, 2009 XII, 719 S. (DE-627)55844234X (DE-576)284272302 0387782184 9780387782188, https://doi.org/10.1007/978-0-387-78219-5 Verlag Volltext, http://dx.doi.org/10.1007/978-0-387-78219-5 Resolving-System lizenzpflichtig Volltext, https://swbplus.bsz-bw.de/bsz302781544cov.jpg V:DE-576 X:springer image/jpeg 20150929173958 Cover, (DE-627)589841629, http://dx.doi.org/10.1007/978-0-387-78219-5 DE-Ch1, DE-Ch1 epn:332404684X 2012-11-09T19:40:53Z, DE-105 epn:3324046858 2018-03-14T09:54:22Z, http://dx.doi.org/10.1007/978-0-387-78219-5 Zum Online-Dokument DE-Zi4, DE-Zi4 epn:3324046874 2012-11-09T19:40:53Z, http://dx.doi.org/10.1007/978-0-387-78219-5 DE-520, DE-520 epn:3324046890 2012-11-09T19:40:53Z
spellingShingle Materials for Advanced Packaging, Electronics, Optical materials, Nanotechnology, Materials, Materials Science, Packaging Materials, Microelectronic packaging, Mikroelektronik
swb_id_str 302781544
title Materials for Advanced Packaging
title_auth Materials for Advanced Packaging
title_full Materials for Advanced Packaging edited by Daniel Lu, C.P. Wong
title_fullStr Materials for Advanced Packaging edited by Daniel Lu, C.P. Wong
title_full_unstemmed Materials for Advanced Packaging edited by Daniel Lu, C.P. Wong
title_short Materials for Advanced Packaging
title_sort materials for advanced packaging
title_unstemmed Materials for Advanced Packaging
topic Electronics, Optical materials, Nanotechnology, Materials, Materials Science, Packaging Materials, Microelectronic packaging, Mikroelektronik
topic_facet Electronics, Optical materials, Nanotechnology, Materials, Materials Science, Packaging, Microelectronic packaging, Mikroelektronik
url https://doi.org/10.1007/978-0-387-78219-5, http://dx.doi.org/10.1007/978-0-387-78219-5, https://swbplus.bsz-bw.de/bsz302781544cov.jpg
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