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Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
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| Zeitschriftentitel: | Solid State Phenomena |
|---|---|
| Personen und Körperschaften: | , , , , |
| In: | Solid State Phenomena, 273, 2018, S. 34-39 |
| Format: | E-Article |
| Sprache: | Unbestimmt |
| veröffentlicht: |
Trans Tech Publications, Ltd.
|
| Schlagwörter: |
| author_facet |
Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor |
|---|---|
| author |
Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor |
| spellingShingle |
Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor Solid State Phenomena Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics |
| author_sort |
said, rita mohd |
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Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor 1662-9779 Trans Tech Publications, Ltd. Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics http://dx.doi.org/10.4028/www.scientific.net/ssp.273.34 <jats:p>Microstructure evolution that exhibit from the reaction of Sn Cu pritectic alloys become an interesting phenomenon that need to be explored since the properties of the alloys depend on their microstructures. Due to less understanding on the solidification behavior on peritectic alloys, extensive research are made on this type of alloys to gain more information regarding on the microstructure formation. This paper reviews the mechanisms on peritectic solidification on Sn Cu based peritectic alloys. The changed in peritectic microstructure due to external source such as direct current (DC) field, ultrasonic field and isothermal time are discuss respectively through this paper. The focus is made on peritectic solidification of Sn Cu based alloy since it has a promising potential for high temperature lead-free solder application.</jats:p> Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review Solid State Phenomena |
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Solid State Phenomena |
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| title |
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_unstemmed |
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_full |
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
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Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
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Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_short |
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_sort |
solidification behavior of sn cu based peritectic alloys: a short review |
| topic |
Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics |
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http://dx.doi.org/10.4028/www.scientific.net/ssp.273.34 |
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2018 |
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34-39 |
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<jats:p>Microstructure evolution that exhibit from the reaction of Sn Cu pritectic alloys become an interesting phenomenon that need to be explored since the properties of the alloys depend on their microstructures. Due to less understanding on the solidification behavior on peritectic alloys, extensive research are made on this type of alloys to gain more information regarding on the microstructure formation. This paper reviews the mechanisms on peritectic solidification on Sn Cu based peritectic alloys. The changed in peritectic microstructure due to external source such as direct current (DC) field, ultrasonic field and isothermal time are discuss respectively through this paper. The focus is made on peritectic solidification of Sn Cu based alloy since it has a promising potential for high temperature lead-free solder application.</jats:p> |
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| author | Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar, Saud, Norainiza, Ramli, Mohd Izrul Izwan, Sandu, Andrei Victor |
| author_facet | Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar, Saud, Norainiza, Ramli, Mohd Izrul Izwan, Sandu, Andrei Victor, Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar, Saud, Norainiza, Ramli, Mohd Izrul Izwan, Sandu, Andrei Victor |
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| description | <jats:p>Microstructure evolution that exhibit from the reaction of Sn Cu pritectic alloys become an interesting phenomenon that need to be explored since the properties of the alloys depend on their microstructures. Due to less understanding on the solidification behavior on peritectic alloys, extensive research are made on this type of alloys to gain more information regarding on the microstructure formation. This paper reviews the mechanisms on peritectic solidification on Sn Cu based peritectic alloys. The changed in peritectic microstructure due to external source such as direct current (DC) field, ultrasonic field and isothermal time are discuss respectively through this paper. The focus is made on peritectic solidification of Sn Cu based alloy since it has a promising potential for high temperature lead-free solder application.</jats:p> |
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| spelling | Said, Rita Mohd Mohd Salleh, Mohd Arif Anuar Saud, Norainiza Ramli, Mohd Izrul Izwan Sandu, Andrei Victor 1662-9779 Trans Tech Publications, Ltd. Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics http://dx.doi.org/10.4028/www.scientific.net/ssp.273.34 <jats:p>Microstructure evolution that exhibit from the reaction of Sn Cu pritectic alloys become an interesting phenomenon that need to be explored since the properties of the alloys depend on their microstructures. Due to less understanding on the solidification behavior on peritectic alloys, extensive research are made on this type of alloys to gain more information regarding on the microstructure formation. This paper reviews the mechanisms on peritectic solidification on Sn Cu based peritectic alloys. The changed in peritectic microstructure due to external source such as direct current (DC) field, ultrasonic field and isothermal time are discuss respectively through this paper. The focus is made on peritectic solidification of Sn Cu based alloy since it has a promising potential for high temperature lead-free solder application.</jats:p> Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review Solid State Phenomena |
| spellingShingle | Said, Rita Mohd, Mohd Salleh, Mohd Arif Anuar, Saud, Norainiza, Ramli, Mohd Izrul Izwan, Sandu, Andrei Victor, Solid State Phenomena, Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review, Condensed Matter Physics, General Materials Science, Atomic and Molecular Physics, and Optics |
| title | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_full | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_fullStr | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_full_unstemmed | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_short | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| title_sort | solidification behavior of sn cu based peritectic alloys: a short review |
| title_unstemmed | Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review |
| topic | Condensed Matter Physics, General Materials Science, Atomic and Molecular Physics, and Optics |
| url | http://dx.doi.org/10.4028/www.scientific.net/ssp.273.34 |