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STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds
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| Zeitschriftentitel: | Solid State Phenomena |
|---|---|
| Personen und Körperschaften: | , , , |
| In: | Solid State Phenomena, 273, 2018, S. 95-100 |
| Format: | E-Article |
| Sprache: | Unbestimmt |
| veröffentlicht: |
Trans Tech Publications, Ltd.
|
| Schlagwörter: |
| author_facet |
Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo |
|---|---|
| author |
Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo |
| spellingShingle |
Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo Solid State Phenomena STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics |
| author_sort |
yang, wen hui |
| spelling |
Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo 1662-9779 Trans Tech Publications, Ltd. Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics http://dx.doi.org/10.4028/www.scientific.net/ssp.273.95 <jats:p>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2110], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>.</jats:p> STEM Analysis of Atom Location in (Cu, Au, Ni)<sub>6</sub>Sn<sub>5</sub> Intermetallic Compounds Solid State Phenomena |
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Trans Tech Publications, Ltd., 2018 |
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Trans Tech Publications, Ltd., 2018 |
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Solid State Phenomena |
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49 |
| title |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_unstemmed |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_full |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_fullStr |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_full_unstemmed |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_short |
STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_sort |
stem analysis of atom location in (cu, au, ni)<sub>6</sub>sn<sub>5</sub> intermetallic compounds |
| topic |
Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics |
| url |
http://dx.doi.org/10.4028/www.scientific.net/ssp.273.95 |
| publishDate |
2018 |
| physical |
95-100 |
| description |
<jats:p>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2110], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>.</jats:p> |
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| author | Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro, Matsumura, Syo |
| author_facet | Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro, Matsumura, Syo, Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro, Matsumura, Syo |
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| container_title | Solid State Phenomena |
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| description | <jats:p>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2110], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>.</jats:p> |
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| spelling | Yang, Wen Hui Yamamoto, Tomokazu Nogita, Kazuhiro Matsumura, Syo 1662-9779 Trans Tech Publications, Ltd. Condensed Matter Physics General Materials Science Atomic and Molecular Physics, and Optics http://dx.doi.org/10.4028/www.scientific.net/ssp.273.95 <jats:p>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub> has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2110], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in <jats:italic>η</jats:italic><jats:italic>-</jats:italic>Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>.</jats:p> STEM Analysis of Atom Location in (Cu, Au, Ni)<sub>6</sub>Sn<sub>5</sub> Intermetallic Compounds Solid State Phenomena |
| spellingShingle | Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro, Matsumura, Syo, Solid State Phenomena, STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds, Condensed Matter Physics, General Materials Science, Atomic and Molecular Physics, and Optics |
| title | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_full | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_fullStr | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_full_unstemmed | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_short | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| title_sort | stem analysis of atom location in (cu, au, ni)<sub>6</sub>sn<sub>5</sub> intermetallic compounds |
| title_unstemmed | STEM Analysis of Atom Location in (Cu, Au, Ni)6Sn5 Intermetallic Compounds |
| topic | Condensed Matter Physics, General Materials Science, Atomic and Molecular Physics, and Optics |
| url | http://dx.doi.org/10.4028/www.scientific.net/ssp.273.95 |