Eintrag weiter verarbeiten
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers
Gespeichert in:
| Zeitschriftentitel: | Materials Science Forum |
|---|---|
| Personen und Körperschaften: | , , |
| In: | Materials Science Forum, 827, 2015, S. 341-346 |
| Format: | E-Article |
| Sprache: | Unbestimmt |
| veröffentlicht: |
Trans Tech Publications, Ltd.
|
| Schlagwörter: |
| author_facet |
Kuwano, Noriyuki Horikami, Sadanori Linus, Marina Kuwano, Noriyuki Horikami, Sadanori Linus, Marina |
|---|---|
| author |
Kuwano, Noriyuki Horikami, Sadanori Linus, Marina |
| spellingShingle |
Kuwano, Noriyuki Horikami, Sadanori Linus, Marina Materials Science Forum Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| author_sort |
kuwano, noriyuki |
| spelling |
Kuwano, Noriyuki Horikami, Sadanori Linus, Marina 1662-9752 Trans Tech Publications, Ltd. Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.4028/www.scientific.net/msf.827.341 <jats:p>The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed <jats:italic>in-situ</jats:italic> in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.</jats:p> Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers Materials Science Forum |
| doi_str_mv |
10.4028/www.scientific.net/msf.827.341 |
| facet_avail |
Online |
| finc_class_facet |
Physik Technik |
| format |
ElectronicArticle |
| fullrecord |
blob:ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuNDAyOC93d3cuc2NpZW50aWZpYy5uZXQvbXNmLjgyNy4zNDE |
| id |
ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuNDAyOC93d3cuc2NpZW50aWZpYy5uZXQvbXNmLjgyNy4zNDE |
| institution |
DE-Pl11 DE-Rs1 DE-105 DE-14 DE-Ch1 DE-L229 DE-D275 DE-Bn3 DE-Brt1 DE-D161 DE-Gla1 DE-Zi4 DE-15 |
| imprint |
Trans Tech Publications, Ltd., 2015 |
| imprint_str_mv |
Trans Tech Publications, Ltd., 2015 |
| issn |
1662-9752 |
| issn_str_mv |
1662-9752 |
| language |
Undetermined |
| mega_collection |
Trans Tech Publications, Ltd. (CrossRef) |
| match_str |
kuwano2015electronmicroscopystudyofgrainboundarybehaviorinpbfreesoldermaterialsformitigationofwhiskers |
| publishDateSort |
2015 |
| publisher |
Trans Tech Publications, Ltd. |
| recordtype |
ai |
| record_format |
ai |
| series |
Materials Science Forum |
| source_id |
49 |
| title |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_unstemmed |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_full |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_fullStr |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_full_unstemmed |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_short |
Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_sort |
electron microscopy study of grain boundary behavior in pb-free solder materials for mitigation of whiskers |
| topic |
Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| url |
http://dx.doi.org/10.4028/www.scientific.net/msf.827.341 |
| publishDate |
2015 |
| physical |
341-346 |
| description |
<jats:p>The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed <jats:italic>in-situ</jats:italic> in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.</jats:p> |
| container_start_page |
341 |
| container_title |
Materials Science Forum |
| container_volume |
827 |
| format_de105 |
Article, E-Article |
| format_de14 |
Article, E-Article |
| format_de15 |
Article, E-Article |
| format_de520 |
Article, E-Article |
| format_de540 |
Article, E-Article |
| format_dech1 |
Article, E-Article |
| format_ded117 |
Article, E-Article |
| format_degla1 |
E-Article |
| format_del152 |
Buch |
| format_del189 |
Article, E-Article |
| format_dezi4 |
Article |
| format_dezwi2 |
Article, E-Article |
| format_finc |
Article, E-Article |
| format_nrw |
Article, E-Article |
| _version_ |
1792321194496622592 |
| geogr_code |
not assigned |
| last_indexed |
2024-03-01T10:58:09.39Z |
| geogr_code_person |
not assigned |
| openURL |
url_ver=Z39.88-2004&ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fvufind.svn.sourceforge.net%3Agenerator&rft.title=Electron+Microscopy+Study+of+Grain+Boundary+Behavior+in+Pb-Free+Solder+Materials+for+Mitigation+of+Whiskers&rft.date=2015-08-01&genre=article&issn=1662-9752&volume=827&spage=341&epage=346&pages=341-346&jtitle=Materials+Science+Forum&atitle=Electron+Microscopy+Study+of+Grain+Boundary+Behavior+in+Pb-Free+Solder+Materials+for+Mitigation+of+Whiskers&aulast=Linus&aufirst=Marina&rft_id=info%3Adoi%2F10.4028%2Fwww.scientific.net%2Fmsf.827.341&rft.language%5B0%5D=und |
| SOLR | |
| _version_ | 1792321194496622592 |
| author | Kuwano, Noriyuki, Horikami, Sadanori, Linus, Marina |
| author_facet | Kuwano, Noriyuki, Horikami, Sadanori, Linus, Marina, Kuwano, Noriyuki, Horikami, Sadanori, Linus, Marina |
| author_sort | kuwano, noriyuki |
| container_start_page | 341 |
| container_title | Materials Science Forum |
| container_volume | 827 |
| description | <jats:p>The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed <jats:italic>in-situ</jats:italic> in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.</jats:p> |
| doi_str_mv | 10.4028/www.scientific.net/msf.827.341 |
| facet_avail | Online |
| finc_class_facet | Physik, Technik |
| format | ElectronicArticle |
| format_de105 | Article, E-Article |
| format_de14 | Article, E-Article |
| format_de15 | Article, E-Article |
| format_de520 | Article, E-Article |
| format_de540 | Article, E-Article |
| format_dech1 | Article, E-Article |
| format_ded117 | Article, E-Article |
| format_degla1 | E-Article |
| format_del152 | Buch |
| format_del189 | Article, E-Article |
| format_dezi4 | Article |
| format_dezwi2 | Article, E-Article |
| format_finc | Article, E-Article |
| format_nrw | Article, E-Article |
| geogr_code | not assigned |
| geogr_code_person | not assigned |
| id | ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuNDAyOC93d3cuc2NpZW50aWZpYy5uZXQvbXNmLjgyNy4zNDE |
| imprint | Trans Tech Publications, Ltd., 2015 |
| imprint_str_mv | Trans Tech Publications, Ltd., 2015 |
| institution | DE-Pl11, DE-Rs1, DE-105, DE-14, DE-Ch1, DE-L229, DE-D275, DE-Bn3, DE-Brt1, DE-D161, DE-Gla1, DE-Zi4, DE-15 |
| issn | 1662-9752 |
| issn_str_mv | 1662-9752 |
| language | Undetermined |
| last_indexed | 2024-03-01T10:58:09.39Z |
| match_str | kuwano2015electronmicroscopystudyofgrainboundarybehaviorinpbfreesoldermaterialsformitigationofwhiskers |
| mega_collection | Trans Tech Publications, Ltd. (CrossRef) |
| physical | 341-346 |
| publishDate | 2015 |
| publishDateSort | 2015 |
| publisher | Trans Tech Publications, Ltd. |
| record_format | ai |
| recordtype | ai |
| series | Materials Science Forum |
| source_id | 49 |
| spelling | Kuwano, Noriyuki Horikami, Sadanori Linus, Marina 1662-9752 Trans Tech Publications, Ltd. Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.4028/www.scientific.net/msf.827.341 <jats:p>The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed <jats:italic>in-situ</jats:italic> in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.</jats:p> Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers Materials Science Forum |
| spellingShingle | Kuwano, Noriyuki, Horikami, Sadanori, Linus, Marina, Materials Science Forum, Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers, Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| title | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_full | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_fullStr | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_full_unstemmed | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_short | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| title_sort | electron microscopy study of grain boundary behavior in pb-free solder materials for mitigation of whiskers |
| title_unstemmed | Electron Microscopy Study of Grain Boundary Behavior in Pb-Free Solder Materials for Mitigation of Whiskers |
| topic | Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| url | http://dx.doi.org/10.4028/www.scientific.net/msf.827.341 |