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Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires
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| Zeitschriftentitel: | Materials Science Forum |
|---|---|
| Personen und Körperschaften: | , |
| In: | Materials Science Forum, 539-543, 2007, S. 2798-2803 |
| Format: | E-Article |
| Sprache: | Unbestimmt |
| veröffentlicht: |
Trans Tech Publications, Ltd.
|
| Schlagwörter: |
| author_facet |
Meng, Liang Liu, J.B. Meng, Liang Liu, J.B. |
|---|---|
| author |
Meng, Liang Liu, J.B. |
| spellingShingle |
Meng, Liang Liu, J.B. Materials Science Forum Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| author_sort |
meng, liang |
| spelling |
Meng, Liang Liu, J.B. 1662-9752 Trans Tech Publications, Ltd. Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.4028/www.scientific.net/msf.539-543.2798 <jats:p>An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.</jats:p> Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires Materials Science Forum |
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Trans Tech Publications, Ltd., 2007 |
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| title |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_unstemmed |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_fullStr |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full_unstemmed |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_short |
Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_sort |
progress and current status in research on nanostructured cu-ag microcomposites for conductor wires |
| topic |
Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| url |
http://dx.doi.org/10.4028/www.scientific.net/msf.539-543.2798 |
| publishDate |
2007 |
| physical |
2798-2803 |
| description |
<jats:p>An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying
is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of
filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and
electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final
annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume,
hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites
possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally
decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the
development and application of the microcomposites.</jats:p> |
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| description | <jats:p>An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.</jats:p> |
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| spelling | Meng, Liang Liu, J.B. 1662-9752 Trans Tech Publications, Ltd. Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.4028/www.scientific.net/msf.539-543.2798 <jats:p>An overview of the microstructure evolution, mechanical properties, electrical conductivity and microalloying is presented and some further research fields are suggested for Cu-Ag microcomposites. The nanostructures of filamentary morphology in these microcomposites can be obtained by heavy deformation. Both the mechanical and electrical properties depend upon the material composition, strain degree, intermediate heat treatments and final annealing processes. These factors strongly affect the phase proportion, microstructure morphology, precipitate volume, hardening level and filamentary distribution. Optimum technology of materials preparation makes the microcomposites possess high strength and conductivity. Some third constituents added to the alloys improve the strength but generally decrease the conductivity. It is considered that relative mechanisms and processes should be further investigated for the development and application of the microcomposites.</jats:p> Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires Materials Science Forum |
| spellingShingle | Meng, Liang, Liu, J.B., Materials Science Forum, Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires, Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| title | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_fullStr | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_full_unstemmed | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_short | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| title_sort | progress and current status in research on nanostructured cu-ag microcomposites for conductor wires |
| title_unstemmed | Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires |
| topic | Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| url | http://dx.doi.org/10.4028/www.scientific.net/msf.539-543.2798 |