author_facet Zheng, Mei Na
Li, Yan Song
Liu, Jun
Zheng, Mei Na
Li, Yan Song
Liu, Jun
author Zheng, Mei Na
Li, Yan Song
Liu, Jun
spellingShingle Zheng, Mei Na
Li, Yan Song
Liu, Jun
Advanced Materials Research
Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
General Engineering
author_sort zheng, mei na
spelling Zheng, Mei Na Li, Yan Song Liu, Jun 1662-8985 Trans Tech Publications, Ltd. General Engineering http://dx.doi.org/10.4028/www.scientific.net/amr.1092-1093.539 <jats:p>In this paper, thermal model of the symmetric rectangular stackable supercapacitors are established. By using the finite element method, the temperature distribution of the supercapacitor is simulated. Then the supercapacitor's thermal behavior under the ambient temperature, but with different current density is analyzed. The simulation results show that the maximum temperature during the discharge process occurs in the center of the supercapacitor. The maximum temperature is associated with the applied current, and the higher the applied current is, the higher the maximum temperature is. It's necessary to control the maximum temperature within the allowable values, by establishing reasonable thermal management systems and cooling systems.</jats:p> Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors Advanced Materials Research
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title Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_unstemmed Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_full Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_fullStr Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_full_unstemmed Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_short Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_sort thermal analysis on symmetric rectangular stackable supercapacitors
topic General Engineering
url http://dx.doi.org/10.4028/www.scientific.net/amr.1092-1093.539
publishDate 2015
physical 539-542
description <jats:p>In this paper, thermal model of the symmetric rectangular stackable supercapacitors are established. By using the finite element method, the temperature distribution of the supercapacitor is simulated. Then the supercapacitor's thermal behavior under the ambient temperature, but with different current density is analyzed. The simulation results show that the maximum temperature during the discharge process occurs in the center of the supercapacitor. The maximum temperature is associated with the applied current, and the higher the applied current is, the higher the maximum temperature is. It's necessary to control the maximum temperature within the allowable values, by establishing reasonable thermal management systems and cooling systems.</jats:p>
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author Zheng, Mei Na, Li, Yan Song, Liu, Jun
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author_sort zheng, mei na
container_start_page 539
container_title Advanced Materials Research
container_volume 1092-1093
description <jats:p>In this paper, thermal model of the symmetric rectangular stackable supercapacitors are established. By using the finite element method, the temperature distribution of the supercapacitor is simulated. Then the supercapacitor's thermal behavior under the ambient temperature, but with different current density is analyzed. The simulation results show that the maximum temperature during the discharge process occurs in the center of the supercapacitor. The maximum temperature is associated with the applied current, and the higher the applied current is, the higher the maximum temperature is. It's necessary to control the maximum temperature within the allowable values, by establishing reasonable thermal management systems and cooling systems.</jats:p>
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spelling Zheng, Mei Na Li, Yan Song Liu, Jun 1662-8985 Trans Tech Publications, Ltd. General Engineering http://dx.doi.org/10.4028/www.scientific.net/amr.1092-1093.539 <jats:p>In this paper, thermal model of the symmetric rectangular stackable supercapacitors are established. By using the finite element method, the temperature distribution of the supercapacitor is simulated. Then the supercapacitor's thermal behavior under the ambient temperature, but with different current density is analyzed. The simulation results show that the maximum temperature during the discharge process occurs in the center of the supercapacitor. The maximum temperature is associated with the applied current, and the higher the applied current is, the higher the maximum temperature is. It's necessary to control the maximum temperature within the allowable values, by establishing reasonable thermal management systems and cooling systems.</jats:p> Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors Advanced Materials Research
spellingShingle Zheng, Mei Na, Li, Yan Song, Liu, Jun, Advanced Materials Research, Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors, General Engineering
title Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_full Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_fullStr Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_full_unstemmed Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_short Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
title_sort thermal analysis on symmetric rectangular stackable supercapacitors
title_unstemmed Thermal Analysis on Symmetric Rectangular Stackable Supercapacitors
topic General Engineering
url http://dx.doi.org/10.4028/www.scientific.net/amr.1092-1093.539