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Experimental Analysis of Thermo‐mechanical Behaviour of Electronic Components with Speckle Interferometry
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Journal Title: | Strain |
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Authors and Corporations: | , , , , |
In: | Strain, 49, 2013, 6, p. 497-506 |
Type of Resource: | E-Article |
Language: | English |
published: |
Wiley
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Subjects: |