author_facet Ding, Maomao
Shi, Ying
Xie, Jianjun
Zhou, Ding
Wang, Yu
Lei, Fang
Zhang, Lei
Ding, Maomao
Shi, Ying
Xie, Jianjun
Zhou, Ding
Wang, Yu
Lei, Fang
Zhang, Lei
author Ding, Maomao
Shi, Ying
Xie, Jianjun
Zhou, Ding
Wang, Yu
Lei, Fang
Zhang, Lei
spellingShingle Ding, Maomao
Shi, Ying
Xie, Jianjun
Zhou, Ding
Wang, Yu
Lei, Fang
Zhang, Lei
International Journal of Applied Ceramic Technology
Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
Materials Chemistry
Marketing
Condensed Matter Physics
Ceramics and Composites
author_sort ding, maomao
spelling Ding, Maomao Shi, Ying Xie, Jianjun Zhou, Ding Wang, Yu Lei, Fang Zhang, Lei 1546-542X 1744-7402 Wiley Materials Chemistry Marketing Condensed Matter Physics Ceramics and Composites http://dx.doi.org/10.1111/ijac.13344 <jats:title>Abstract</jats:title><jats:p>Aluminum nitride (AlN) ceramic substrates have been fabricated using non‐aqueous tape casting and pressureless densification under flowing N<jats:sub>2</jats:sub> atmosphere. Considering the economic and environmental impact, a new strategy of solvent and dispersant system was adopted to prepare AlN slurries with high solid loading. According to the viscosity characteristics of AlN slurries, dispersant content was adjusted to be 0.5 wt% of AlN powder in order to optimize the rheological behavior of AlN slurries. The addition contents of binder and plasticizer were both optimized as 5 wt% of AlN powders by combining the viscosity of slurries and tensile strength of green tapes. Green AlN tapes were fabricated with an optimized tape casting process such as dry temperature. The exclusion process of organic additives was investigated by employing thermogravimetric analysis. Flat and dense AlN ceramic substrates with a relative bulk density over 99.75 % were achieved after being sintered under 1800°C for 6 hours, which had a maximum size of 110 × 110 mm. The thermal conductivity of the AlN substrate could reach 145 Wm<jats:sup>−1</jats:sup>K<jats:sup>−1</jats:sup>.</jats:p> Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates International Journal of Applied Ceramic Technology
doi_str_mv 10.1111/ijac.13344
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series International Journal of Applied Ceramic Technology
source_id 49
title Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_unstemmed Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_full Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_fullStr Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_full_unstemmed Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_short Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_sort optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
topic Materials Chemistry
Marketing
Condensed Matter Physics
Ceramics and Composites
url http://dx.doi.org/10.1111/ijac.13344
publishDate 2020
physical 285-295
description <jats:title>Abstract</jats:title><jats:p>Aluminum nitride (AlN) ceramic substrates have been fabricated using non‐aqueous tape casting and pressureless densification under flowing N<jats:sub>2</jats:sub> atmosphere. Considering the economic and environmental impact, a new strategy of solvent and dispersant system was adopted to prepare AlN slurries with high solid loading. According to the viscosity characteristics of AlN slurries, dispersant content was adjusted to be 0.5 wt% of AlN powder in order to optimize the rheological behavior of AlN slurries. The addition contents of binder and plasticizer were both optimized as 5 wt% of AlN powders by combining the viscosity of slurries and tensile strength of green tapes. Green AlN tapes were fabricated with an optimized tape casting process such as dry temperature. The exclusion process of organic additives was investigated by employing thermogravimetric analysis. Flat and dense AlN ceramic substrates with a relative bulk density over 99.75 % were achieved after being sintered under 1800°C for 6 hours, which had a maximum size of 110 × 110 mm. The thermal conductivity of the AlN substrate could reach 145 Wm<jats:sup>−1</jats:sup>K<jats:sup>−1</jats:sup>.</jats:p>
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author Ding, Maomao, Shi, Ying, Xie, Jianjun, Zhou, Ding, Wang, Yu, Lei, Fang, Zhang, Lei
author_facet Ding, Maomao, Shi, Ying, Xie, Jianjun, Zhou, Ding, Wang, Yu, Lei, Fang, Zhang, Lei, Ding, Maomao, Shi, Ying, Xie, Jianjun, Zhou, Ding, Wang, Yu, Lei, Fang, Zhang, Lei
author_sort ding, maomao
container_issue 1
container_start_page 285
container_title International Journal of Applied Ceramic Technology
container_volume 17
description <jats:title>Abstract</jats:title><jats:p>Aluminum nitride (AlN) ceramic substrates have been fabricated using non‐aqueous tape casting and pressureless densification under flowing N<jats:sub>2</jats:sub> atmosphere. Considering the economic and environmental impact, a new strategy of solvent and dispersant system was adopted to prepare AlN slurries with high solid loading. According to the viscosity characteristics of AlN slurries, dispersant content was adjusted to be 0.5 wt% of AlN powder in order to optimize the rheological behavior of AlN slurries. The addition contents of binder and plasticizer were both optimized as 5 wt% of AlN powders by combining the viscosity of slurries and tensile strength of green tapes. Green AlN tapes were fabricated with an optimized tape casting process such as dry temperature. The exclusion process of organic additives was investigated by employing thermogravimetric analysis. Flat and dense AlN ceramic substrates with a relative bulk density over 99.75 % were achieved after being sintered under 1800°C for 6 hours, which had a maximum size of 110 × 110 mm. The thermal conductivity of the AlN substrate could reach 145 Wm<jats:sup>−1</jats:sup>K<jats:sup>−1</jats:sup>.</jats:p>
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spelling Ding, Maomao Shi, Ying Xie, Jianjun Zhou, Ding Wang, Yu Lei, Fang Zhang, Lei 1546-542X 1744-7402 Wiley Materials Chemistry Marketing Condensed Matter Physics Ceramics and Composites http://dx.doi.org/10.1111/ijac.13344 <jats:title>Abstract</jats:title><jats:p>Aluminum nitride (AlN) ceramic substrates have been fabricated using non‐aqueous tape casting and pressureless densification under flowing N<jats:sub>2</jats:sub> atmosphere. Considering the economic and environmental impact, a new strategy of solvent and dispersant system was adopted to prepare AlN slurries with high solid loading. According to the viscosity characteristics of AlN slurries, dispersant content was adjusted to be 0.5 wt% of AlN powder in order to optimize the rheological behavior of AlN slurries. The addition contents of binder and plasticizer were both optimized as 5 wt% of AlN powders by combining the viscosity of slurries and tensile strength of green tapes. Green AlN tapes were fabricated with an optimized tape casting process such as dry temperature. The exclusion process of organic additives was investigated by employing thermogravimetric analysis. Flat and dense AlN ceramic substrates with a relative bulk density over 99.75 % were achieved after being sintered under 1800°C for 6 hours, which had a maximum size of 110 × 110 mm. The thermal conductivity of the AlN substrate could reach 145 Wm<jats:sup>−1</jats:sup>K<jats:sup>−1</jats:sup>.</jats:p> Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates International Journal of Applied Ceramic Technology
spellingShingle Ding, Maomao, Shi, Ying, Xie, Jianjun, Zhou, Ding, Wang, Yu, Lei, Fang, Zhang, Lei, International Journal of Applied Ceramic Technology, Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates, Materials Chemistry, Marketing, Condensed Matter Physics, Ceramics and Composites
title Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_full Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_fullStr Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_full_unstemmed Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_short Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_sort optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
title_unstemmed Optimization of non‐aqueous tape casting of high solid loading slurry for aluminum nitride ceramic substrates
topic Materials Chemistry, Marketing, Condensed Matter Physics, Ceramics and Composites
url http://dx.doi.org/10.1111/ijac.13344