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Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens
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Zeitschriftentitel: | Microscopy Today |
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Personen und Körperschaften: | , |
In: | Microscopy Today, 15, 2007, 6, S. 38-39 |
Format: | E-Article |
Sprache: | Englisch |
veröffentlicht: |
Oxford University Press (OUP)
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Schlagwörter: |
author_facet |
MacMahon, D J Raz-Moyal, E MacMahon, D J Raz-Moyal, E |
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author |
MacMahon, D J Raz-Moyal, E |
spellingShingle |
MacMahon, D J Raz-Moyal, E Microscopy Today Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens Pharmacology |
author_sort |
macmahon, d j |
spelling |
MacMahon, D J Raz-Moyal, E 2150-3583 1551-9295 Oxford University Press (OUP) Pharmacology http://dx.doi.org/10.1017/s1551929500061952 <jats:title>Abstract</jats:title> <jats:p>Semiconductor manufacturers are increasingly turning to Transmission Electron Microscopes (TEMs) to monitor product yield and process control, analyze defects, and investigate interface layer morphology. To prepare TEM specimens, Focused Ion Beam (FIB) technology is an invaluable tool, yielding a standard milled TEM lamella approximately 15 μm wide, 5 μm deep and ~100 nm thick. Several techniques have been developed to extract these tiny objects from a large wafer and view it in the TEM. These techniques, including ex-situ lift-out, H-bar, and in-situ lift-out, have different advantages and disadvantages, but all require painstaking preparation of one specimen at a time.</jats:p> Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens Microscopy Today |
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2007 |
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Oxford University Press (OUP) |
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Microscopy Today |
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49 |
title |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_unstemmed |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_full |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_fullStr |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_full_unstemmed |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_short |
Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_sort |
computer-controlled polishing system for preparing multiple pre-fib tem specimens |
topic |
Pharmacology |
url |
http://dx.doi.org/10.1017/s1551929500061952 |
publishDate |
2007 |
physical |
38-39 |
description |
<jats:title>Abstract</jats:title>
<jats:p>Semiconductor manufacturers are increasingly turning to Transmission Electron Microscopes (TEMs) to monitor product yield and process control, analyze defects, and investigate interface layer morphology. To prepare TEM specimens, Focused Ion Beam (FIB) technology is an invaluable tool, yielding a standard milled TEM lamella approximately 15 μm wide, 5 μm deep and ~100 nm thick. Several techniques have been developed to extract these tiny objects from a large wafer and view it in the TEM. These techniques, including ex-situ lift-out, H-bar, and in-situ lift-out, have different advantages and disadvantages, but all require painstaking preparation of one specimen at a time.</jats:p> |
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author | MacMahon, D J, Raz-Moyal, E |
author_facet | MacMahon, D J, Raz-Moyal, E, MacMahon, D J, Raz-Moyal, E |
author_sort | macmahon, d j |
container_issue | 6 |
container_start_page | 38 |
container_title | Microscopy Today |
container_volume | 15 |
description | <jats:title>Abstract</jats:title> <jats:p>Semiconductor manufacturers are increasingly turning to Transmission Electron Microscopes (TEMs) to monitor product yield and process control, analyze defects, and investigate interface layer morphology. To prepare TEM specimens, Focused Ion Beam (FIB) technology is an invaluable tool, yielding a standard milled TEM lamella approximately 15 μm wide, 5 μm deep and ~100 nm thick. Several techniques have been developed to extract these tiny objects from a large wafer and view it in the TEM. These techniques, including ex-situ lift-out, H-bar, and in-situ lift-out, have different advantages and disadvantages, but all require painstaking preparation of one specimen at a time.</jats:p> |
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spelling | MacMahon, D J Raz-Moyal, E 2150-3583 1551-9295 Oxford University Press (OUP) Pharmacology http://dx.doi.org/10.1017/s1551929500061952 <jats:title>Abstract</jats:title> <jats:p>Semiconductor manufacturers are increasingly turning to Transmission Electron Microscopes (TEMs) to monitor product yield and process control, analyze defects, and investigate interface layer morphology. To prepare TEM specimens, Focused Ion Beam (FIB) technology is an invaluable tool, yielding a standard milled TEM lamella approximately 15 μm wide, 5 μm deep and ~100 nm thick. Several techniques have been developed to extract these tiny objects from a large wafer and view it in the TEM. These techniques, including ex-situ lift-out, H-bar, and in-situ lift-out, have different advantages and disadvantages, but all require painstaking preparation of one specimen at a time.</jats:p> Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens Microscopy Today |
spellingShingle | MacMahon, D J, Raz-Moyal, E, Microscopy Today, Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens, Pharmacology |
title | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_full | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_fullStr | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_full_unstemmed | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_short | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
title_sort | computer-controlled polishing system for preparing multiple pre-fib tem specimens |
title_unstemmed | Computer-Controlled Polishing System For Preparing Multiple Pre-FIB TEM Specimens |
topic | Pharmacology |
url | http://dx.doi.org/10.1017/s1551929500061952 |