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Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu
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| Zeitschriftentitel: | Surface and Interface Analysis |
|---|---|
| Personen und Körperschaften: | , |
| In: | Surface and Interface Analysis, 18, 1992, 7, S. 509-513 |
| Format: | E-Article |
| Sprache: | Englisch |
| veröffentlicht: |
Wiley
|
| Schlagwörter: |
| author_facet |
Yoshitake, M. Yoshihara, K. Yoshitake, M. Yoshihara, K. |
|---|---|
| author |
Yoshitake, M. Yoshihara, K. |
| spellingShingle |
Yoshitake, M. Yoshihara, K. Surface and Interface Analysis Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu Materials Chemistry Surfaces, Coatings and Films Surfaces and Interfaces Condensed Matter Physics General Chemistry |
| author_sort |
yoshitake, m. |
| spelling |
Yoshitake, M. Yoshihara, K. 0142-2421 1096-9918 Wiley Materials Chemistry Surfaces, Coatings and Films Surfaces and Interfaces Condensed Matter Physics General Chemistry http://dx.doi.org/10.1002/sia.740180710 <jats:title>Abstract</jats:title><jats:p>The surface segregation of the substrate element on metal film by diffusion through the film was studied. Six film/substrate couples—Nb/Ti, Ti/Nb, Cu/Nb, Nb/Cu, Cu/Ti and Ti/Cu—deposited by rf magnetron sputtering were applied to investigate segregation behaviour, as well as Nb/Ti and Ti/Nb deposited by electron beam. The segregation behaviour of the substrate element by diffusion through the films was monitored at the film surface by AES. For Nb/Ti, Cu/Nb, Cu/Ti and Ti/Cu, the substrate element segregated on the film surface by diffusing through the film with a diffusion coefficient much larger than that corresponding to volume diffusion in the bulk. The segregation of Cu on Ti film was affected by an exposure of 2.6 × 10<jats:sup>−6</jats:sup> Pa oxygen during heating. The activation energy for this diffusion was ∼60% of that in the bulk and the diffusion path seems to be the grain boundaries. The occurrence of this segregation via grain boundary diffusion did not depend on the film preparation process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease of the surface free energy of film by the segregation of substrate element on grain boundaries and surfaces of films.</jats:p> Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu Surface and Interface Analysis |
| doi_str_mv |
10.1002/sia.740180710 |
| facet_avail |
Online |
| finc_class_facet |
Physik Chemie und Pharmazie Allgemeines Technik |
| format |
ElectronicArticle |
| fullrecord |
blob:ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTAwMi9zaWEuNzQwMTgwNzEw |
| id |
ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTAwMi9zaWEuNzQwMTgwNzEw |
| institution |
DE-D275 DE-Bn3 DE-Brt1 DE-D161 DE-Gla1 DE-Zi4 DE-15 DE-Pl11 DE-Rs1 DE-105 DE-14 DE-Ch1 DE-L229 |
| imprint |
Wiley, 1992 |
| imprint_str_mv |
Wiley, 1992 |
| issn |
0142-2421 1096-9918 |
| issn_str_mv |
0142-2421 1096-9918 |
| language |
English |
| mega_collection |
Wiley (CrossRef) |
| match_str |
yoshitake1992surfacesegregationofsubstrateelementonmetalfilmsinfilmsubstratecombinationswithnbtiandcu |
| publishDateSort |
1992 |
| publisher |
Wiley |
| recordtype |
ai |
| record_format |
ai |
| series |
Surface and Interface Analysis |
| source_id |
49 |
| title |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_unstemmed |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_full |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_fullStr |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_full_unstemmed |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_short |
Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_sort |
surface segregation of substrate element on metal films in film/substrate combinations with nb, ti and cu |
| topic |
Materials Chemistry Surfaces, Coatings and Films Surfaces and Interfaces Condensed Matter Physics General Chemistry |
| url |
http://dx.doi.org/10.1002/sia.740180710 |
| publishDate |
1992 |
| physical |
509-513 |
| description |
<jats:title>Abstract</jats:title><jats:p>The surface segregation of the substrate element on metal film by diffusion through the film was studied. Six film/substrate couples—Nb/Ti, Ti/Nb, Cu/Nb, Nb/Cu, Cu/Ti and Ti/Cu—deposited by rf magnetron sputtering were applied to investigate segregation behaviour, as well as Nb/Ti and Ti/Nb deposited by electron beam. The segregation behaviour of the substrate element by diffusion through the films was monitored at the film surface by AES. For Nb/Ti, Cu/Nb, Cu/Ti and Ti/Cu, the substrate element segregated on the film surface by diffusing through the film with a diffusion coefficient much larger than that corresponding to volume diffusion in the bulk. The segregation of Cu on Ti film was affected by an exposure of 2.6 × 10<jats:sup>−6</jats:sup> Pa oxygen during heating. The activation energy for this diffusion was ∼60% of that in the bulk and the diffusion path seems to be the grain boundaries. The occurrence of this segregation via grain boundary diffusion did not depend on the film preparation process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease of the surface free energy of film by the segregation of substrate element on grain boundaries and surfaces of films.</jats:p> |
| container_issue |
7 |
| container_start_page |
509 |
| container_title |
Surface and Interface Analysis |
| container_volume |
18 |
| format_de105 |
Article, E-Article |
| format_de14 |
Article, E-Article |
| format_de15 |
Article, E-Article |
| format_de520 |
Article, E-Article |
| format_de540 |
Article, E-Article |
| format_dech1 |
Article, E-Article |
| format_ded117 |
Article, E-Article |
| format_degla1 |
E-Article |
| format_del152 |
Buch |
| format_del189 |
Article, E-Article |
| format_dezi4 |
Article |
| format_dezwi2 |
Article, E-Article |
| format_finc |
Article, E-Article |
| format_nrw |
Article, E-Article |
| _version_ |
1792336771775725578 |
| geogr_code |
not assigned |
| last_indexed |
2024-03-01T15:05:44.927Z |
| geogr_code_person |
not assigned |
| openURL |
url_ver=Z39.88-2004&ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fvufind.svn.sourceforge.net%3Agenerator&rft.title=Surface+segregation+of+substrate+element+on+metal+films+in+film%2Fsubstrate+combinations+with+Nb%2C+Ti+and+Cu&rft.date=1992-07-01&genre=article&issn=1096-9918&volume=18&issue=7&spage=509&epage=513&pages=509-513&jtitle=Surface+and+Interface+Analysis&atitle=Surface+segregation+of+substrate+element+on+metal+films+in+film%2Fsubstrate+combinations+with+Nb%2C+Ti+and+Cu&aulast=Yoshihara&aufirst=K.&rft_id=info%3Adoi%2F10.1002%2Fsia.740180710&rft.language%5B0%5D=eng |
| SOLR | |
| _version_ | 1792336771775725578 |
| author | Yoshitake, M., Yoshihara, K. |
| author_facet | Yoshitake, M., Yoshihara, K., Yoshitake, M., Yoshihara, K. |
| author_sort | yoshitake, m. |
| container_issue | 7 |
| container_start_page | 509 |
| container_title | Surface and Interface Analysis |
| container_volume | 18 |
| description | <jats:title>Abstract</jats:title><jats:p>The surface segregation of the substrate element on metal film by diffusion through the film was studied. Six film/substrate couples—Nb/Ti, Ti/Nb, Cu/Nb, Nb/Cu, Cu/Ti and Ti/Cu—deposited by rf magnetron sputtering were applied to investigate segregation behaviour, as well as Nb/Ti and Ti/Nb deposited by electron beam. The segregation behaviour of the substrate element by diffusion through the films was monitored at the film surface by AES. For Nb/Ti, Cu/Nb, Cu/Ti and Ti/Cu, the substrate element segregated on the film surface by diffusing through the film with a diffusion coefficient much larger than that corresponding to volume diffusion in the bulk. The segregation of Cu on Ti film was affected by an exposure of 2.6 × 10<jats:sup>−6</jats:sup> Pa oxygen during heating. The activation energy for this diffusion was ∼60% of that in the bulk and the diffusion path seems to be the grain boundaries. The occurrence of this segregation via grain boundary diffusion did not depend on the film preparation process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease of the surface free energy of film by the segregation of substrate element on grain boundaries and surfaces of films.</jats:p> |
| doi_str_mv | 10.1002/sia.740180710 |
| facet_avail | Online |
| finc_class_facet | Physik, Chemie und Pharmazie, Allgemeines, Technik |
| format | ElectronicArticle |
| format_de105 | Article, E-Article |
| format_de14 | Article, E-Article |
| format_de15 | Article, E-Article |
| format_de520 | Article, E-Article |
| format_de540 | Article, E-Article |
| format_dech1 | Article, E-Article |
| format_ded117 | Article, E-Article |
| format_degla1 | E-Article |
| format_del152 | Buch |
| format_del189 | Article, E-Article |
| format_dezi4 | Article |
| format_dezwi2 | Article, E-Article |
| format_finc | Article, E-Article |
| format_nrw | Article, E-Article |
| geogr_code | not assigned |
| geogr_code_person | not assigned |
| id | ai-49-aHR0cDovL2R4LmRvaS5vcmcvMTAuMTAwMi9zaWEuNzQwMTgwNzEw |
| imprint | Wiley, 1992 |
| imprint_str_mv | Wiley, 1992 |
| institution | DE-D275, DE-Bn3, DE-Brt1, DE-D161, DE-Gla1, DE-Zi4, DE-15, DE-Pl11, DE-Rs1, DE-105, DE-14, DE-Ch1, DE-L229 |
| issn | 0142-2421, 1096-9918 |
| issn_str_mv | 0142-2421, 1096-9918 |
| language | English |
| last_indexed | 2024-03-01T15:05:44.927Z |
| match_str | yoshitake1992surfacesegregationofsubstrateelementonmetalfilmsinfilmsubstratecombinationswithnbtiandcu |
| mega_collection | Wiley (CrossRef) |
| physical | 509-513 |
| publishDate | 1992 |
| publishDateSort | 1992 |
| publisher | Wiley |
| record_format | ai |
| recordtype | ai |
| series | Surface and Interface Analysis |
| source_id | 49 |
| spelling | Yoshitake, M. Yoshihara, K. 0142-2421 1096-9918 Wiley Materials Chemistry Surfaces, Coatings and Films Surfaces and Interfaces Condensed Matter Physics General Chemistry http://dx.doi.org/10.1002/sia.740180710 <jats:title>Abstract</jats:title><jats:p>The surface segregation of the substrate element on metal film by diffusion through the film was studied. Six film/substrate couples—Nb/Ti, Ti/Nb, Cu/Nb, Nb/Cu, Cu/Ti and Ti/Cu—deposited by rf magnetron sputtering were applied to investigate segregation behaviour, as well as Nb/Ti and Ti/Nb deposited by electron beam. The segregation behaviour of the substrate element by diffusion through the films was monitored at the film surface by AES. For Nb/Ti, Cu/Nb, Cu/Ti and Ti/Cu, the substrate element segregated on the film surface by diffusing through the film with a diffusion coefficient much larger than that corresponding to volume diffusion in the bulk. The segregation of Cu on Ti film was affected by an exposure of 2.6 × 10<jats:sup>−6</jats:sup> Pa oxygen during heating. The activation energy for this diffusion was ∼60% of that in the bulk and the diffusion path seems to be the grain boundaries. The occurrence of this segregation via grain boundary diffusion did not depend on the film preparation process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease process. From these results, the driving force of the segregation via grain boundary diffusion may be the decrease of the surface free energy of film by the segregation of substrate element on grain boundaries and surfaces of films.</jats:p> Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu Surface and Interface Analysis |
| spellingShingle | Yoshitake, M., Yoshihara, K., Surface and Interface Analysis, Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu, Materials Chemistry, Surfaces, Coatings and Films, Surfaces and Interfaces, Condensed Matter Physics, General Chemistry |
| title | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_full | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_fullStr | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_full_unstemmed | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_short | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| title_sort | surface segregation of substrate element on metal films in film/substrate combinations with nb, ti and cu |
| title_unstemmed | Surface segregation of substrate element on metal films in film/substrate combinations with Nb, Ti and Cu |
| topic | Materials Chemistry, Surfaces, Coatings and Films, Surfaces and Interfaces, Condensed Matter Physics, General Chemistry |
| url | http://dx.doi.org/10.1002/sia.740180710 |