author_facet DeMaio, A.
Patterson, T.
DeMaio, A.
Patterson, T.
author DeMaio, A.
Patterson, T.
spellingShingle DeMaio, A.
Patterson, T.
Journal of Applied Polymer Science
Rheological modeling of the tensile creep behavior of paper
Materials Chemistry
Polymers and Plastics
Surfaces, Coatings and Films
General Chemistry
author_sort demaio, a.
spelling DeMaio, A. Patterson, T. 0021-8995 1097-4628 Wiley Materials Chemistry Polymers and Plastics Surfaces, Coatings and Films General Chemistry http://dx.doi.org/10.1002/app.26895 <jats:title>Abstract</jats:title><jats:p>Paper is a networked structure of randomly bonded fibers. These fibers are composed of naturally occurring polymeric materials (cellulose, hemicelluloses, and lignin). Polymeric materials such as these exhibit viscoelastic deformation, and as a result, creep under an applied stress. A rheological model has been developed to predict the tensile creep behavior of paper under a uni‐axial stress. Specifically, the focus of this model was to predict creep strain using only stress, time, and efficiency factor (effectiveness of bonding). This rheological model offers insight into creep behavior (drawing from molecular creep mechanisms) and separates total strain from creep into initial elastic, primary creep, and secondary creep components. Interfiber bonding is taken into account through the use of an efficiency factor which represents how effectively bonding is distributing load throughout the fiber network of the paper. As a result, this model makes it possible to predict the creep behavior of paper over a range of bonding levels, induced by mechanical changes in bonded area or chemical modification of specific bond strength, using creep data from paper at any single level of bonding. This utility is retained as long as the fibers and the orientation of the fibers are not changed. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007</jats:p> Rheological modeling of the tensile creep behavior of paper Journal of Applied Polymer Science
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series Journal of Applied Polymer Science
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title Rheological modeling of the tensile creep behavior of paper
title_unstemmed Rheological modeling of the tensile creep behavior of paper
title_full Rheological modeling of the tensile creep behavior of paper
title_fullStr Rheological modeling of the tensile creep behavior of paper
title_full_unstemmed Rheological modeling of the tensile creep behavior of paper
title_short Rheological modeling of the tensile creep behavior of paper
title_sort rheological modeling of the tensile creep behavior of paper
topic Materials Chemistry
Polymers and Plastics
Surfaces, Coatings and Films
General Chemistry
url http://dx.doi.org/10.1002/app.26895
publishDate 2007
physical 3543-3554
description <jats:title>Abstract</jats:title><jats:p>Paper is a networked structure of randomly bonded fibers. These fibers are composed of naturally occurring polymeric materials (cellulose, hemicelluloses, and lignin). Polymeric materials such as these exhibit viscoelastic deformation, and as a result, creep under an applied stress. A rheological model has been developed to predict the tensile creep behavior of paper under a uni‐axial stress. Specifically, the focus of this model was to predict creep strain using only stress, time, and efficiency factor (effectiveness of bonding). This rheological model offers insight into creep behavior (drawing from molecular creep mechanisms) and separates total strain from creep into initial elastic, primary creep, and secondary creep components. Interfiber bonding is taken into account through the use of an efficiency factor which represents how effectively bonding is distributing load throughout the fiber network of the paper. As a result, this model makes it possible to predict the creep behavior of paper over a range of bonding levels, induced by mechanical changes in bonded area or chemical modification of specific bond strength, using creep data from paper at any single level of bonding. This utility is retained as long as the fibers and the orientation of the fibers are not changed. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007</jats:p>
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author DeMaio, A., Patterson, T.
author_facet DeMaio, A., Patterson, T., DeMaio, A., Patterson, T.
author_sort demaio, a.
container_issue 5
container_start_page 3543
container_title Journal of Applied Polymer Science
container_volume 106
description <jats:title>Abstract</jats:title><jats:p>Paper is a networked structure of randomly bonded fibers. These fibers are composed of naturally occurring polymeric materials (cellulose, hemicelluloses, and lignin). Polymeric materials such as these exhibit viscoelastic deformation, and as a result, creep under an applied stress. A rheological model has been developed to predict the tensile creep behavior of paper under a uni‐axial stress. Specifically, the focus of this model was to predict creep strain using only stress, time, and efficiency factor (effectiveness of bonding). This rheological model offers insight into creep behavior (drawing from molecular creep mechanisms) and separates total strain from creep into initial elastic, primary creep, and secondary creep components. Interfiber bonding is taken into account through the use of an efficiency factor which represents how effectively bonding is distributing load throughout the fiber network of the paper. As a result, this model makes it possible to predict the creep behavior of paper over a range of bonding levels, induced by mechanical changes in bonded area or chemical modification of specific bond strength, using creep data from paper at any single level of bonding. This utility is retained as long as the fibers and the orientation of the fibers are not changed. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007</jats:p>
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spelling DeMaio, A. Patterson, T. 0021-8995 1097-4628 Wiley Materials Chemistry Polymers and Plastics Surfaces, Coatings and Films General Chemistry http://dx.doi.org/10.1002/app.26895 <jats:title>Abstract</jats:title><jats:p>Paper is a networked structure of randomly bonded fibers. These fibers are composed of naturally occurring polymeric materials (cellulose, hemicelluloses, and lignin). Polymeric materials such as these exhibit viscoelastic deformation, and as a result, creep under an applied stress. A rheological model has been developed to predict the tensile creep behavior of paper under a uni‐axial stress. Specifically, the focus of this model was to predict creep strain using only stress, time, and efficiency factor (effectiveness of bonding). This rheological model offers insight into creep behavior (drawing from molecular creep mechanisms) and separates total strain from creep into initial elastic, primary creep, and secondary creep components. Interfiber bonding is taken into account through the use of an efficiency factor which represents how effectively bonding is distributing load throughout the fiber network of the paper. As a result, this model makes it possible to predict the creep behavior of paper over a range of bonding levels, induced by mechanical changes in bonded area or chemical modification of specific bond strength, using creep data from paper at any single level of bonding. This utility is retained as long as the fibers and the orientation of the fibers are not changed. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007</jats:p> Rheological modeling of the tensile creep behavior of paper Journal of Applied Polymer Science
spellingShingle DeMaio, A., Patterson, T., Journal of Applied Polymer Science, Rheological modeling of the tensile creep behavior of paper, Materials Chemistry, Polymers and Plastics, Surfaces, Coatings and Films, General Chemistry
title Rheological modeling of the tensile creep behavior of paper
title_full Rheological modeling of the tensile creep behavior of paper
title_fullStr Rheological modeling of the tensile creep behavior of paper
title_full_unstemmed Rheological modeling of the tensile creep behavior of paper
title_short Rheological modeling of the tensile creep behavior of paper
title_sort rheological modeling of the tensile creep behavior of paper
title_unstemmed Rheological modeling of the tensile creep behavior of paper
topic Materials Chemistry, Polymers and Plastics, Surfaces, Coatings and Films, General Chemistry
url http://dx.doi.org/10.1002/app.26895