Further processing options
Packaging of High Power Semiconductor Lasers
Saved in:
Authors and Corporations: | , , |
---|---|
Title: | Packaging of High Power Semiconductor Lasers/ by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
Type of Resource: | E-Book |
Language: | English |
published: |
New York, NY, s.l.
Springer New York
2015
|
Series: |
Micro- and Opto-Electronic Materials, Structures, and Systems SpringerLink |
Subjects: | |
Druckausg.: | Packaging of high power semiconductor lasers, New York : Springer, 2015, XV, 402 S. |
Source: | Verbunddaten SWB |
Access Information: | Elektronischer Volltext - Campuslizenz |