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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

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Authors and Corporations: Liu, Yong (Author)
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling/ by Yong Liu
Type of Resource: E-Book
Language: English
published:
Boston, MA Springer US 2012
Series: SpringerLink
Subjects:
Electronics
Systems engineering
Production of electric energy or power
Engineering
Electronic packaging
Buchausg.: Liu, Yong, Power electronic packaging, New York : Springer, 2012, XVIII, 591 S.
Source: Verbunddaten SWB
Access Information: Elektronischer Volltext - Campuslizenz