Optimized adaptive layout technique for hybrid systems in foil
Compactness, cost, flexibility, and size of electronic devices play an important role for next generation consumer electronics. Flexible hybrid system in foil (HySiF) technology provides an optimum solution by combining low-cost, large and flexible organic with high circuit performance silicon ....
|Journal Title:||2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition|
|Authors and Corporations:||, , , ,|
|In:||2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, p. 1-5|
|Type of Resource:||E-Article|