An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper
An ultra-thin (20 μm), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In...
|Journal Title:||IEEE Journal of Solid-State Circuits|
|Authors and Corporations:||, , ,|
|In:||IEEE Journal of Solid-State Circuits, 51, 2016, 1, p. 273-280|
|Type of Resource:||E-Article|