Low-cost microbolometer with nano-scaled plasmonic absorbers for far infrared thermal imaging applic...
We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The performance loss due to the resulting backside illum...
|Journal Title:||2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)|
|Authors and Corporations:||, , , , , , ,|
|In:||2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, p. 572-575|
|Type of Resource:||E-Article|