Self-aligned through silicon vias in ultra-thin chips for 3D-integration
Here, we present a new concept for enabling the formation of TSVs in ultra-thin chips fabricated by using the Chipfilm<sup>TM</sup> technology. In this technology a buried cavity is created underneath a Si-membrane which is attached to the substrate by vertical silicon anchors. By applyi...
|Journal Title:||2012 4th Electronic System-Integration Technology Conference|
|Authors and Corporations:||, , ,|
|In:||2012 4th Electronic System-Integration Technology Conference, 2012, p. 1-4|
|Type of Resource:||E-Article|