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Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications
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| Zeitschriftentitel: | Advances in Radio Science |
|---|---|
| Personen und Körperschaften: | , , , |
| In: | Advances in Radio Science, 16, 2018, S. 109-116 |
| Format: | E-Article |
| Sprache: | Englisch |
| veröffentlicht: |
Copernicus GmbH
|
| Schlagwörter: |
| author_facet |
Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. |
|---|---|
| author |
Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. |
| spellingShingle |
Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. Advances in Radio Science Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications General Medicine |
| author_sort |
eldebiky, amro |
| spelling |
Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. 1684-9973 Copernicus GmbH General Medicine http://dx.doi.org/10.5194/ars-16-109-2018 <jats:p>Abstract. Hybrid System-in-Foil (HySiF) is one of the emerging branches of flexible electronics in which ultra-thin silicon chips are integrated with flexible sensors in polymeric foils (Elsobky et al., 2018; Alavi et al., 2018). Intensive attention was given to the implementation of flexible environmental sensing platforms for logistics and food packaging (Cartasegna et al., 2011; Liu et al., 2016). The aim of this work is the implementation of a sensor system demonstrator using HySiF components, namely an ultra-thin microcontroller chip in addition to an on-chip temperature and an on-foil humidity sensors. The measurement concept for the relative humidity sensor is measuring the capacitance difference between an off-chip (on the foil substrate) humidity dependent sensor capacitor, and another humidity independent reference capacitor. The electrical readout technique is based on the charge amplifier switched capacitor circuit. It is implemented using a commercially available microcontroller (EM microelectronics EM6819) which has the advantage of being available as single chips to enable post-processing steps such as backthining and chip embedding in a thin polymer package. Sensor and reference capacitors are homogeneously integrated on-foil. 400 and 30 µm thick microcontroller dies (MCU) are used in this application. The charge amplifier result is digitized using an internal 10-bit analog-to-digital converter (ADC). The 10-bit ADC is time multiplexed between the charge amplifier structure and the internal temperature sensor. Linear interpolation is used to fit the digital output of the ADC and calibrate the output of the sensor system. Readings of the humidity level and the temperature are written to an NFC tag (from the company EM microelectronics based on chip EM NF4) using the contact interface. Readings can be accessed using a customized android application on a smartphone. </jats:p> Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications Advances in Radio Science |
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Copernicus GmbH, 2018 |
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Advances in Radio Science |
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| title |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_unstemmed |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_full |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_fullStr |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_full_unstemmed |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_short |
Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_sort |
humidity and temperature sensor system demonstrator with nfc tag for hysif applications |
| topic |
General Medicine |
| url |
http://dx.doi.org/10.5194/ars-16-109-2018 |
| publishDate |
2018 |
| physical |
109-116 |
| description |
<jats:p>Abstract. Hybrid System-in-Foil (HySiF) is one of the emerging branches of flexible
electronics in which ultra-thin silicon chips are integrated with flexible
sensors in polymeric foils (Elsobky et al., 2018; Alavi et al., 2018). Intensive attention was given to the
implementation of flexible environmental sensing platforms for logistics and
food packaging (Cartasegna et al., 2011; Liu et al., 2016). The aim of this work is the implementation of a
sensor system demonstrator using HySiF components, namely an ultra-thin
microcontroller chip in addition to an on-chip temperature and an on-foil
humidity sensors. The measurement concept for the relative humidity sensor is
measuring the capacitance difference between an off-chip (on the foil
substrate) humidity dependent sensor capacitor, and another humidity
independent reference capacitor. The electrical readout technique is based on
the charge amplifier switched capacitor circuit. It is implemented using a
commercially available microcontroller (EM microelectronics EM6819) which has
the advantage of being available as single chips to enable post-processing
steps such as backthining and chip embedding in a thin polymer package.
Sensor and reference capacitors are homogeneously integrated on-foil. 400
and 30 µm thick microcontroller dies (MCU) are used in
this application. The charge amplifier result is digitized using an internal
10-bit analog-to-digital converter (ADC). The 10-bit ADC is time multiplexed
between the charge amplifier structure and the internal temperature sensor.
Linear interpolation is used to fit the digital output of the ADC and
calibrate the output of the sensor system. Readings of the humidity level and
the temperature are written to an NFC tag (from the company EM
microelectronics based on chip EM NF4) using the contact interface. Readings
can be accessed using a customized android application on a smartphone.
</jats:p> |
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| author | Eldebiky, Amro, Elsobky, Mourad, Richter, Harald, Burghartz, Joachim N. |
| author_facet | Eldebiky, Amro, Elsobky, Mourad, Richter, Harald, Burghartz, Joachim N., Eldebiky, Amro, Elsobky, Mourad, Richter, Harald, Burghartz, Joachim N. |
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| description | <jats:p>Abstract. Hybrid System-in-Foil (HySiF) is one of the emerging branches of flexible electronics in which ultra-thin silicon chips are integrated with flexible sensors in polymeric foils (Elsobky et al., 2018; Alavi et al., 2018). Intensive attention was given to the implementation of flexible environmental sensing platforms for logistics and food packaging (Cartasegna et al., 2011; Liu et al., 2016). The aim of this work is the implementation of a sensor system demonstrator using HySiF components, namely an ultra-thin microcontroller chip in addition to an on-chip temperature and an on-foil humidity sensors. The measurement concept for the relative humidity sensor is measuring the capacitance difference between an off-chip (on the foil substrate) humidity dependent sensor capacitor, and another humidity independent reference capacitor. The electrical readout technique is based on the charge amplifier switched capacitor circuit. It is implemented using a commercially available microcontroller (EM microelectronics EM6819) which has the advantage of being available as single chips to enable post-processing steps such as backthining and chip embedding in a thin polymer package. Sensor and reference capacitors are homogeneously integrated on-foil. 400 and 30 µm thick microcontroller dies (MCU) are used in this application. The charge amplifier result is digitized using an internal 10-bit analog-to-digital converter (ADC). The 10-bit ADC is time multiplexed between the charge amplifier structure and the internal temperature sensor. Linear interpolation is used to fit the digital output of the ADC and calibrate the output of the sensor system. Readings of the humidity level and the temperature are written to an NFC tag (from the company EM microelectronics based on chip EM NF4) using the contact interface. Readings can be accessed using a customized android application on a smartphone. </jats:p> |
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| spelling | Eldebiky, Amro Elsobky, Mourad Richter, Harald Burghartz, Joachim N. 1684-9973 Copernicus GmbH General Medicine http://dx.doi.org/10.5194/ars-16-109-2018 <jats:p>Abstract. Hybrid System-in-Foil (HySiF) is one of the emerging branches of flexible electronics in which ultra-thin silicon chips are integrated with flexible sensors in polymeric foils (Elsobky et al., 2018; Alavi et al., 2018). Intensive attention was given to the implementation of flexible environmental sensing platforms for logistics and food packaging (Cartasegna et al., 2011; Liu et al., 2016). The aim of this work is the implementation of a sensor system demonstrator using HySiF components, namely an ultra-thin microcontroller chip in addition to an on-chip temperature and an on-foil humidity sensors. The measurement concept for the relative humidity sensor is measuring the capacitance difference between an off-chip (on the foil substrate) humidity dependent sensor capacitor, and another humidity independent reference capacitor. The electrical readout technique is based on the charge amplifier switched capacitor circuit. It is implemented using a commercially available microcontroller (EM microelectronics EM6819) which has the advantage of being available as single chips to enable post-processing steps such as backthining and chip embedding in a thin polymer package. Sensor and reference capacitors are homogeneously integrated on-foil. 400 and 30 µm thick microcontroller dies (MCU) are used in this application. The charge amplifier result is digitized using an internal 10-bit analog-to-digital converter (ADC). The 10-bit ADC is time multiplexed between the charge amplifier structure and the internal temperature sensor. Linear interpolation is used to fit the digital output of the ADC and calibrate the output of the sensor system. Readings of the humidity level and the temperature are written to an NFC tag (from the company EM microelectronics based on chip EM NF4) using the contact interface. Readings can be accessed using a customized android application on a smartphone. </jats:p> Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications Advances in Radio Science |
| spellingShingle | Eldebiky, Amro, Elsobky, Mourad, Richter, Harald, Burghartz, Joachim N., Advances in Radio Science, Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications, General Medicine |
| title | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_full | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_fullStr | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_full_unstemmed | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_short | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| title_sort | humidity and temperature sensor system demonstrator with nfc tag for hysif applications |
| title_unstemmed | Humidity and temperature sensor system demonstrator with NFC tag for HySiF applications |
| topic | General Medicine |
| url | http://dx.doi.org/10.5194/ars-16-109-2018 |