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Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch
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Journal Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
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Authors and Corporations: | , , , , |
In: | IEEE Transactions on Components, Packaging and Manufacturing Technology, 8, 2018, 5, p. 802-810 |
Type of Resource: | E-Article |
Language: | Undetermined |
published: |
Institute of Electrical and Electronics Engineers (IEEE)
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Subjects: |