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Molecular Dynamics Simulation of Heat Transport through Solid–Liquid Interface during Argon Droplet Evaporation on Heated Substrates
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Journal Title: | Langmuir |
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Authors and Corporations: | , , , , |
In: | Langmuir, 35, 2019, 6, p. 2164-2171 |
Type of Resource: | E-Article |
Language: | English |
published: |
American Chemical Society (ACS)
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Subjects: |